3D Integration Engineer H/F

Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems. The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit 🐈 ⬛. In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously! We're a diverse team of 250+ brilliant minds from over 35 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together! Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems. The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit 🐈 ⬛. In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously! We're a diverse team of 250+ brilliant minds from over 35 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together! We are seeking a Senior 3D Integration Engineer H/F to join the Process Integration team within the Quantum Hardware & Infrastructure department. This position sits at the intersection of nanofabrication, assembly and scalable QPU design, working closely with teams across the hardware organization — from roadmap to fabrication, packaging, and validation.

Responsabilities

Identify and benchmark enabling 3D assembly technologies for QPUs in accordance with superconducting-circuit constraints: material/process compatibility, microwave performance, and cryogenic reliability Develop and qualify the 3D integration building blocks — airbridges, flip-chip bonding, TSV, multi-layer wiring (MLW), superconducting interconnects, and wafer-level assembly — in close collaboration with fabrication and packaging teams Develop and coordinate integration test plans in collaboration with cross-functional teams Establish scalable, well-documented integration procedures to support system growth Investigate and resolve integration issues and technical anomalies, ensuring alignment with specifications and overall performance targets Act as the technical point of contact for 3D integration with external foundries, packaging partners, and equipment vendors, in close collaboration with our foundry partnerships expert