The posting, in Alice & Bob's own words
archived Oct 19, 2026Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems. The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit 🐈 ⬛. In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously! We're a diverse team of 250+ brilliant minds from over 35 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together!
Responsibilities:
Characterize the current readout chain and define the specification Map the existing chain: assembly time, defect rate, insertion losses, footprint Define the specification with the operation and RF teams: number of lines (target 32), MXC envelope, insertion loss budget, thermalization requirements Study and select the mechanical architecture Compare two architectures: a pre-cabled block with non-threaded connections, and a block with a single plug interface to the MXC Benchmark compact components available on the market Build a decision matrix and defend the chosen architecture in design review Design the readout module Produce the CAD model, drawings and a costed bill of materials (BOM) Select materials and design thermalization to the MXC plate Define torque specifications and perform the SMP tolerance stack-up Choose connectors compatible with a future board-edge/PCB integration Write an assembly and inspection procedure that a subcontractor can follow Build and validate a prototype in the cryostat Assemble the prototype and measure the real assembly time Perform SOLT/SOLR calibration and S-parameter characterization at room temperature and cold Compare performance against the SMA reference chain and write a measurement report Recommend the path to industrialization Deliver a go/no-go recommendation based on measurement results Build an industrialization roadmap, including inputs for the phase-2 PCB study
Read the full posting ↓
Requirements:
Final-year Master's or engineering student in mechanical engineering or mechatronics , with an interest in RF and cryogenic hardware. Hands-on and rigorous, you enjoys building, testing and documenting hardware and is comfortable presenting technical choices to multidisciplinary teams. Mechanical design for assembly (DFA) and tolerance analysis (stack-ups) Proficiency in CAD (SolidWorks) and technical drawing Material selection and thermal design, ideally with an interest in cryogenic constraints Basic knowledge of RF connectors and coaxial lines (a plus) Interest in RF measurements (VNA, S-parameters) and cryogenics Hands-on approach: comfortable assembling and testing hardware Rigor and clear technical documentation Ability to structure and present technical choices in a design review LANGUAGES: Proficient in English EXPERIENCE: No minimum required. A previous internship or project in mechanical design, prototyping or testing is a plus. Availability: 6 months.